Advanced System-on-Package (SOP) Multilayer Architectures for RF/Wireless Systems up to Millimeter-Wave Frequency Bands
نویسنده
چکیده
This paper reviews the development of advanced System-on-Package (SOP) architectures for the compact and low cost wireless RF wireless systems. A compact stacked patch antenna adopting soft-and-hard surface structures and cavity resonator filters using inter-resonance coupling mechanism for V-band applications are presented. A novel ultra-compact 3D integration technology is proposed and utilized for the implementation of a Ku-band VCO module. The high Q-factor inductors fabricated on the Liquid Crystal Polymer based multilayer substrate demonstrate superior performance than conventional organic packages.
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